July 19, 2017 / 4:45 PM / in 3 months

BRIEF-3D Signatures Inc. announces short form prospectus offering to raise up to C$5 million

July 19 (Reuters) - 3d Signatures Inc:

* 3D Signatures Inc. announces short form prospectus offering to raise up to C$5 million

* Short form prospectus offering up to 12.5 million common shares in capital of company at a price of C$0.40 per common share

* Plans to employ approximately 40 percent of net proceeds from offering to complete validation program for company’s Telo-HL test

* To employ about 20 percent of proceeds from offering to undertake pilot studies to determine applicability of co’s Teloview software

* Co will use about 40 percent of net proceeds from offering to fund clinical wages, laboratory expenses related to co’s ongoing research and development activities Source text for Eikon: Further company coverage:

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