** ASML remains one of Berenberg's favorite semi equipment names, brokerage says as chipmakers are ready to adopt extreme ultraviolet lithography (EUV)
** Rising demand for thinner and more powerful smartphones driving EUV demand
** Brokerage says mainstream chipmakers will adopt EUV technology on time (within 2019/20 timeframe) with Samsung and TSMC already having outlined their EUV timeline
** Berenberg: "We expect the competition between TSMC, Samsung and Intel to intensify, to the benefit of ASML"
** Brokerage maintains "buy" but ups PT to EUR 131 (+31%)